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| Underfill Resin
Underfill resin to prevent defective connection between PCB and Package caused by CSP (Chip Scale package), BGA (Ball Grid Array) Flip chip, etc. |
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| DAM / FILL / COB
Heating hardening epoxy forming material to protect chip circuit for high density module on semi-conductor parts. |
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| Adhesive
1. Heat hardening epoxy adhesive for SMD of chip and package. 2. Uv hardening adhesive to connect Non-heating parts. |
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| Molding Compound Photo Device
Optical transmission Epoxy Encapsulent to protect photo devices; photo-diode, photo-TR, etc, against outdoor surroundings. |
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| Coating Resin
1. Humid-preventing coating for semi-conductor package, hard to form 2. Conduction Coating material to prevent static electricity. |
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| Conductive Paste
Conduction Silver Epoxy adhesive for chip connection. |
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