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Underfill Resin
Underfill resin to prevent defective connection between PCB and Package caused by CSP (Chip Scale package), BGA (Ball Grid Array) Flip chip, etc.

DAM / FILL / COB
Heating hardening epoxy forming material to protect chip circuit for high density module on semi-conductor parts.

Adhesive
1. Heat hardening epoxy adhesive for SMD of chip and package.
2. Uv hardening adhesive to connect Non-heating parts.

Molding Compound Photo Device
Optical transmission Epoxy Encapsulent to protect photo devices; photo-diode, photo-TR, etc, against outdoor surroundings.

Coating Resin
1. Humid-preventing coating for semi-conductor package, hard to form
2. Conduction Coating material to prevent static electricity.

Conductive Paste
Conduction Silver Epoxy adhesive for chip connection.





Homepage : http://wonchem.koreasme.com
Company : Won Chemical .co.Ltd
Phone : 82-31-354-3773
FAX : 82-31-354-3772
Address : 84-20, deoku-ri , paltan-myun, hwaseong-city kuynggi-do korea(Zip Code: 445-912)
URL : http://wonchem.koreasme.com
E-mail : wonchem@unitel.co.kr